@Article{BonettiFrCaSaViCoTr:2006:AdStDi,
author = "Bonetti, Lu\í and Francisco, s and Capote, Gil and Santos,
L\ú and Vieira, cia and Corat, Evaldo Jos\é and
Trava-Airoldi, Vladimir Jesus",
affiliation = "Instituto Nacional de Pesquisas Espaciais, Laborat\ó and {rio
Associado de Sensores e Materiais (INPE.LAC)} and Instituto
Nacional de Pesquisas Espaciais, Laborat\ó and {rio Associado
de Sensores e Materiais (INPE.LAC)} and Instituto Nacional de
Pesquisas Espaciais, Laborat\ó and {rio Associado de Sensores
e Materiais (INPE.LAC)} and Instituto Nacional de Pesquisas
Espaciais, Laborat\ó and {rio Associado de Sensores e
Materiais (INPE.LAC)} and Instituto Nacional de Pesquisas
Espaciais, Laborat\ó and {rio Associado de Sensores e
Materiais (INPE.LAC)}",
title = "Adhesion studies of diamond-like carbon films deposited on Ti6Al4V
substrate with a silicon interlayer",
journal = "Thin Solid Films",
year = "2006",
volume = "In press",
keywords = "Diamond-like carbon (DLC), PECVD, Silicon interlayer, Adhesion.",
abstract = "Diamond-like carbon (DLC) films have proven quite advantageous in
many tribological applications due to their low friction
coefficient, their extreme hardness, and more recently their high
adherence on different substrate materials. However, for many
applications, DLC films as thick as 2 {\`{\i}}m are required,
which cause high residual stress. In order to overcome this
problem, this study observed the behavior of different thicknesses
of silicon interlayer between DLC films and Ti6Al4V substrates.
The study also analyzed the relation of growth parameters to the
mechanical properties of DLC films. Silicon and DLC films were
grown by using a rf-PECVD at 13.56 MHz with silane and methane
atmospheres, respectively. The contribution of an interlayer
thickness to the adhesion between the DLC films and Ti6Al4V
substrate was evaluated by using a micro-scratch technique. The
hardness and friction coefficient were evaluated by using
microindentation and lateral force microscopy (LFM), respectively.
Raman scattering spectroscopy was used to characterize the film
quality. A correlation was found between the intrinsic stress and
adhesion of DLC film and the parameters of the silicon interlayer
growth. The addition of a silicon interlayer successfully reduced
intrinsic stress of the films, even as measured by using a
perfilometry technique.",
issn = "0040-6090",
language = "en",
targetfile = "Adhesion studies of diamond like carbon.pdf",
urlaccessdate = "27 abr. 2024"
}